| 摘要 |
PURPOSE:To eliminate the contamination for a wafer being treated and to facilitate it to turn the pretreatment process into an in-line system by a method wherein both surfaces of the wafer to be treated are simultaneously scrubbed with a pair of brushes, which are both equal in rotational direction and are different from each other in rotating stress, which exerts on the wafer being treated. CONSTITUTION:In a condition that a rotating substrate 3 is being stopped and hollow supports 7b, 7c and 7a are being made to respectively function as a vacuum-chuck, scrubbing brushes 9a and 9b are made to advance until a position where the points of the brushes 9a and 9b go beyond the center Ow of a wafer W to be treated while the brushes 9a and 9b are coming in contact to both surfaces of the wafer W to be treated and are holding the wafer W to be treated between them. Then, the hollow supports 7a-7c are respectively changed over to a water bearing or an air bearing and the scrubbing of both surfaces of the wafer W is performed while the scrubbing brushes 9a and 9b, which are different from each other in fractional force to the wafer W, are being made to revolve to the same direction and the wafer W to be treated is being made to rotate by a difference between the fractional stresses in a condition that the wafer W to be treated has been made to float. At this time, cleaning water is sprayed on both surfaces of the wafer W to be treated from water jetting means 12a and 12b. |
