| 摘要 |
<p>PURPOSE:To provide a semiconductor device which can attain shortening of lead correcting time and elimination of special tools, by making leads, at least outer lead sections, of a shape memory alloy. CONSTITUTION:Around a semiconductor device 12, a plurality of leads 13 of shape memory alloy are provided. Electrode sections on the semiconductor device 12 and the leads 13 are electrically connected with bonding wire 14 respectively, and the semiconductor device 12 is sealed in a package. Since the leads 13 are made of shape memory alloy, the leads can be prevented from bending greatly in the IC manufacturing process. Accordingly, in the lead bend correcting process, the heating in an oven is sufficient for the correcting, without using a lead correcting machine or manual correcting as in prior arts. Thus the lead bend correcting can be attained in a short time, while special tools such as a lead correcting machine is not required.</p> |
