发明名称 WIRE BONDING METHOD
摘要 PURPOSE:To bond wirings without thermal damage by locally heating a portion to be wire-bonded by a laser light, and then press-bonding gold wirings to the portion by a supersonic vibration. CONSTITUTION:When an optical box 15 is moved to a position where the optical axis of a light projecting port 21 at the lower surface of the box coincides with the central axis of a capillary 6 and stopped, a laser light source 13 is operated to emit a laser light 18 from the port 21 to a portion 3 to be wire- bonded. When the portion 3 is locally heated to the prescribed temperature, the light source 13 is stopped, and the box 15 is laterally moved. When the box 15 moves, the capillary 6 and a horn 10 move down, the lower end of the capillary 6 pushes the gold sphere of Au wirings 5 to the locally heated part of the portion 3, and press-bonds it by a supersonic vibration. Thus, a wire bonding is performed without thermal damage even with the deterioration of thermal resistance.
申请公布号 JPS6218725(A) 申请公布日期 1987.01.27
申请号 JP19850157733 申请日期 1985.07.17
申请人 NEC KANSAI LTD 发明人 MORINAKA RYUICHIRO
分类号 H01L21/60;H01L21/607 主分类号 H01L21/60
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