| 摘要 |
PURPOSE:To provide a semiconductor lead frame, in which the bending rigidity of a tab is high and warping due to difference in thermal expansions among semiconductor-package constituting materials is hard to occur, by forming a warping preventing part on the entire surface or a part of the tab. CONSTITUTION:On a tab 1 of a lead frame, a corrugated part 2 as a warping preventing part is formed in the direction perpendicular to the direction of a tab suspending lead 4 on the entire surface of the tab 1. The corrugated part 2 is formed by press working when, e.g., the lead frame is formed. A semiconductor chip 6 is mounted on the tab 1. The entire body is molded with a resin 8 such as epoxy. A gap 12 is formed between the surface of the tab 1, which is formed when the tab 1 is molded in the wave form, and the semiconductor chip 6. The gap 12 is filled with a bonding material 9 such as silver paste and solder at the time of bonding of the semiconductor chip 6. Thus the heat dissipating property of the semiconductor chip 6 is not impaired. |
