| 摘要 |
A multi-die IC package structure and a method of manufacturing this multi-die IC package structure are proposed. This multi-die IC package structure is constructed on a lead frame including an inner-lead part having a plurality of inner leads surrounding a cavity in the center thereof, without the forming of a die pad. Next, a stacked multi-die structure is mounted on the inner-lead part of the lead frame, which is formed in such a manner the undermost semiconductor die has its non-circuit surface insulatively attached to the inner-lead part of the lead frame and its circuit surface insulatively attached to the overlying one, and also in such a manner that each of the semiconductor dies other than the undermost one has its non-circuit surface insulatively attached to the circuit surface of the underlying one. By the proposed method, the overall packaging process is significantly less complex than the prior art, thus allowing the manufacture process more cost-effective to carry out.
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