MATERIAL FOR RESIN SEALING OF SEMICONDUCTOR DEVICE

摘要

PURPOSE:To obtain a resin sealing material having suppressed deterioration with time and capable of prolonging the life of a semiconductor device, by compounding a specific insulation material as a filler to a base resin. CONSTITUTION:The objective material having a flexural strength of <=12kgf/ mm<2> is produced by compounding an insulation material having smaller elastic coefficient than fused silica (e.g. high-lead glass) as a filler.