2-PHENYL-4,5-DIBENZYLIMIDAZOLE, SYNTHETIC METHOD OF SAID COMPOUND AND METHOD FOR CURING POLYEPOXY RESIN USING SAID COMPOUND

摘要

NEW MATERIAL:A compound expressed by formula I. USE:A curing agent for polyepoxy resins. PREPARATION:A compound expressed by formula II is heated with benzyl chloride at 300-320 deg.C for several hours to give the aimed compound expressed by formula I. A small amount of potassium iodide as a reaction accelerator may be added. 10-15pts.wt. compound expressed by formula I is added to 100pts.wt. polyepoxy resin, and the resultant mixture is normally heated at 100-150 deg.C for maximum 8hr to cure the polyepoxy resin.