| 摘要 |
PURPOSE:To reduce a mounting area by fitting a photosensor and a treater onto the surface and back of a substrate in a cylindrical type package. CONSTITUTION:A square-shaped opening hole 8 is formed on the upper end side of a circular type package 7 made of ceramics, stepped sections 9 are shaped around the internal end of the opening hole 8, and a square-shaped opening hole 10 is shaped to the bottom end of the package 7. The package 7 has laminated structure, metallic patterns for wirings are printed and wired on the inside, and the lead terminal 10 made of a metal is formed to a projecting shape to the back of the package 7, and connected to the metallic patterns, etc. A photosensor 12 is housed into the upper opening hole 8 for the package 7, and connected and wired to the metallic patterns, etc. through the so-called wire bonding, etc., and electric parts, such as an arithmetic processing integrated circuit element 13, a chip resistor 14, a capacitor 15, etc. are housed into the opening hole 10 from the back side of the package 7, and connected and wired through the so-called wire bonding and soldering and the like. Accordingly, a mounting area can be reduced, and the method is particularly advantageous on the adjustment of the alignment of an optical axis. |
