发明名称 HYBRID IC
摘要 PURPOSE:To eliminate the need for plating by coating the outside of a metallic lid with a case made of a synthetic resin. CONSTITUTION:Since a case 4 made of a synthetic resin is fitted outside a metallic lid 3 and all of the outer circumferential surface of the metallic lid 3 are coated with the case 4 consisting of the synthetic resin, sections undesirable on a fine view, such as flaws, rust, etc. cannot be viewed from the outside even when these sections are generated on the surface of the metallic lid 3 in a molding process. Since moisture is also interrupted by the case 4, no rust is generated. Accordingly, various plating need not be executed onto the surface of the metallic lid 3, thus economizing cost corresponding to the unnecessity of plating.
申请公布号 JPS61278152(A) 申请公布日期 1986.12.09
申请号 JP19850120302 申请日期 1985.06.03
申请人 TOSHIBA CORP 发明人 KAGEYAMA SEIICHI
分类号 H01L23/02;H01L23/06 主分类号 H01L23/02
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