| 摘要 |
<p>A resin composition comprising a free thiol group-containing novel polybutadiene derivative can be cured by applying heat or radiation (particularly UV rays) to produce a cured product having excellent chemical, physical, and mechanical properties, particularly excellent photo-sensitive properties. The cured film has an excellent resistance against an electroless plating solution and has an excellent ability of preventing abnormal plating upon electroless plating, thus being suited for forming plated resist film in the process of producing circuit boards according to additive process. The composition provides high-density circuit boards because of its excellent photo-sensitive properties, particularly excellent resolving power.</p> |
