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发明名称
METHOD OF PACKAGING BONDING WIRE FOR SEMICONDUCTOR DEVICE
摘要
申请公布号
JPS61273365(A)
申请公布日期
1986.12.03
申请号
JP19850101608
申请日期
1985.05.15
申请人
MITSUBISHI METAL CORP
发明人
UCHIYAMA NAOKI
分类号
B65D81/20
主分类号
B65D81/20
代理机构
代理人
主权项
地址
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