| 摘要 |
PURPOSE:To improve moisture resistance of a semiconductor device, by providing waterproof films at a part, which is to become a boundary between a lead frame, to which a semiconductor chip is die-bonded, and a resin mold. CONSTITUTION:An integrated circuit is formed on a semiconductor IC chip 11. A plastic package is completed through resin sealing of the semiconductor chip 11 and outer lead processing. Waterproof films 16 are formed on both surfaces of a lead frame 12 by using a resin, which does not include a parting agent, so that the films cover the boundary between a resin mold 13 and the lead frame 12. Since the waterproof films 16 are provided and the IC chip is sealed by the resin by using the lead frame, the lead frame is reinforced. The device is reinforced against outer lead processing. Intrusion of water is prevented, and moisture resistance of the plastic package is improved. |
