| 摘要 |
PURPOSE:To enable to simultaneously inspect a plurality of chips without inspecting pads in the chips by controlling inspecting means in response to a control signal input without pad from an external control signal line to inspect an object to be inspected in the chip, and outputting the result through pad to an external result signal line. CONSTITUTION:When a wafer 2 is put in an inspecting device, it is positioned, and probes 6a, 6b are connected through a pad 5. When an inspecting mode and a power source are supplied, inspection control means 8 of all chips 3 of lateral direction connected with a control signal line 1 controls inspecting means 9 according to the mode. Then, it decides the inspection of any of the functions of an object 11 to be inspected. The result of inspecting the object 11 by the means 9 is fed to inspect result output means 10, and output to a result signal line 4 out of the chip 3. The result is output from the probe 6b out of the wafer 2, and compared with an expecting value. Thus, the inspection of the all chips 3 of lateral direction connected with the line 1 is finished. |
