| 摘要 |
PURPOSE:To impart stress made more increased by applying the expansion stress generated in an interior other than the expansion or contraction stress of a resin from the outside, by applying hygroscopic treatment to electric parts before applying heat treatment thererto. CONSTITUTION:A semiconductor apparatus 2 is introduced into a pressure test apparatus 1 to be hermetically sealed therein. A water tank 3 is received in the pressure test apparatus 1 and a heater 4 is heated to form a saturated steam state and water is penetrated into the seal resin of the semiconductor apparatus 2. Because steam pressure changes by temp., a hygroscopic amount can be changed by setting temp. and a time. After hygroscopic treatment, the semiconductor apparatus 2 is immersed in a high temp. solder tank to repeat heat treatment many times and severe stress can be applied to the semiconductor apparatus from the inside and outside.
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