发明名称 THERMOSETTING RESIN COMPOSITION
摘要 PURPOSE:The titled composition having a low dielectric constant, a small coefficient of linear expansion and excellent heat resistance, comprising a specified bis(cyclopentadienyl) compound and a polymaleimide. CONSTITUTION:20-80wt% bis(cyclopentadienyl) compound of formula I (wherein X is a halogen, n is 0-4 and a is 0-20), e.g., alpha,alpha'-bis(cyclopentadienyl)-2,3,5,6- tetarchloro-p-xylene oligomer, is mixed with a polymaleimide of formula II (wherein R1 is a b-valent 2C or higher organic group and b is 2-10), e.g., N,N'- p,p'-diphenylmethanebismaleimide, at a temperature <=100 deg.C in the absence or presence of a solvent (e.g., chloroform), and when a solvent is used, it is recovered by application of vacuum or heat to obtain the titled uniform composition.
申请公布号 JPS61255916(A) 申请公布日期 1986.11.13
申请号 JP19850098498 申请日期 1985.05.09
申请人 HITACHI CHEM CO LTD 发明人 FUJIOKA ATSUSHI;MIYADERA YASUO;FUKUDA TOMIO
分类号 C08F20/00;C08F20/52;C08F32/00;C08F222/40;C08F232/00 主分类号 C08F20/00
代理机构 代理人
主权项
地址