| 摘要 |
<p>PURPOSE:To reduce adhesiveness securely in a short time by a method wherein a semiconductor wafer is stuck to a UV-cured type adhesive sheet and the wafer is divided into semiconductor elements and lights are applied to the back side and the front side of the sheet. CONSTITUTION:Scribed grooves 6 are formed by scribing the exposed surface 1a of a semiconductor wafer 1. The wafer 1 is divided into semiconductor pellets 7 by dicing. An adhesive sheet 5 is expanded to the radial direction to make spaces between the pellets 7. Lights 8a and 8b, which reduce the adhesiveness of the adhesive sheet 5, are applied to the back side of the sheet substrate 5a and to the exposed surfaces of the pellets 7. If the lights 8a and 8b are UV rays, curing of the adhesive layer 5b is progressed from the whole surface of the adhesive layer 5b on the substrate 5a side, from the exposed surface on the side of pellet 7 sticking and from the circumference parts of the back sides of the pellets 7. With this constitution, the adhesiveness can be reduced securely in a short time.</p> |
