Apparatus and method for establishing a thermal link between a semiconductor package and the cooling plate and an electrical link between the conductors of the package, and a printed circuit board.

摘要

The dissipation of the heat is provided for by a dissipator 30 placed beneath a printed circuit board 15. The package 10 containing a component and having conductors 11 which emerge on several sides is positioned on the dissipator 20 so that the conductors 11 can be connected electrically to conductors 16 of the printed circuit, same surrounding two and preferably three sides of the package 10. The package is fixed to the dissipator by an elastic clip. Conduction between the package and the dissipator can be increased by a compressible, heat-conducting material. <IMAGE>