| 摘要 |
PURPOSE:To enhance adhesion of a fine pattern, such as LSI, by oxidizing a copper surface in advance and then forming a polyimide pattern. CONSTITUTION:The copper surface is oxidized in an atmosphere of air or oxygen, at >=100 deg.C. For example, copper is deposited by sputtering on a ceramic substrate heated at about 120 deg.C, the copper surface is coated with a polyimide precursor, and further, with a positive type photoresist layer, exposed through a mask, developed, and etched in succession, and finally, heated to form a polyimide pattern. The oxidation treatment of the copper surface permits adhesion between the polyimide film and the copper surface to be remarkably strengthened. |
