发明名称 |
Polymerizable planarization layer for integrated circuit structures |
摘要 |
The invention comprises an improvement in the process of manufacturing an integrated circuit structure having stepped topography which comprises coating the integrated circuit structure with a polymerizable material in the substantial absence of a solvent and then polymerizing the material to provide a substantially planar surface on the integrated circuit structure. |
申请公布号 |
US4619837(A) |
申请公布日期 |
1986.10.28 |
申请号 |
US19850697363 |
申请日期 |
1985.02.01 |
申请人 |
ADVANCED MICRO DEVICES, INC. |
发明人 |
BROWN, ANDREW V. |
分类号 |
B05D5/00;B05D7/24;H01L21/312;H01L23/29;H01L23/31;(IPC1-7):B05D3/06 |
主分类号 |
B05D5/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|