| 摘要 |
PURPOSE:To detect any wire bonding slip by electrical measurement by a method wherein detecting wirings are made on the surface of protective film around the periphery of openings and then the wirings are connected to probing pads independently formed on the surface of protective film. CONSTITUTION:Wirings 6, 7 encircling an opening are commonly connected by connecting lines 12, 13 encircling the other openings of a bonding pad 3. The wirings 6, 7 reach two probing pads 10, 11 exposing to the surface of element. Any wire bond slip can be detected by means of bringing probes 15, 16 into contact with the probing pads 10, 11 for checking conduction of the wire bonding. In other words, if all wire bondings are acceptable, there must be no conduction at all, however if there is any wire bonding slip, the end of contact bonding part will shortcircuit two wirings 6, 7 around the periphery of an opening to make the wirings conductive thus detecting that the wire bonding is defective. |
