| 摘要 |
PURPOSE:To attain to enhance mold release characteristics, by forming a high frequency sputtering thin film comprising silicon dioxide to the part contacted with a molding rubber material of a mold. CONSTITUTION:In a sputtering chamber 5, a mold 1 to be treated after washing is mounted on a lower electrode 3 and a disc shaped silicon oxide target 4 is attached to the upper electrode 3 opposed to said electrode 2. Then, the sputtering chamber 5 is evacuated so as to reach a high vacuum degree and argon gas is introduced into the sputtering chamber 5 from a line 7 in this state and high frequency from a RF power source 8 and a matching device 9 is applied to the lower electrode 2 while the pressure in said chamber 5 is regulated by a valve to perform sputtering etching and a high frequency sputtering thin film comprising silicon dioxide is formed to the surface of the mold 1. The silicon dioxide sputtering thin film formed on the surface of the mold by this method is largely lowered in the adhesion of scum and a mold release inferiority ratio and the number of vulcanization times before the washing of the mold are also markedly increased.
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