发明名称 CREAMY SOLDER COATING EQUIPMENT
摘要 PURPOSE:To enable the soldering on electronic circuit board surely in short time of the adequate quantity of solder even for the minute shaped pattern by using both the solder coating mechanism in a screen printing method and the air pressure mechanism in a dispenser method. CONSTITUTION:A notched hole 6 is provided on the continuous metal strip 1 having flexibility and the solder 5 filled up in the notched hole 6 by the coating mechanism 2 is adhered with its dislocation on the electronic circuit board 4 by the air jet when the metal strip 1 comes under the air jet mechanism 3 with turning. By using both the solder coating mechanism in the screen printing method and the air pressure mechanism in the dispenser method like this the adequate solder quantity can be coated on the electronic circuit board surely and yet in short time even for the minute shaped pattern.
申请公布号 JPS61238465(A) 申请公布日期 1986.10.23
申请号 JP19850080821 申请日期 1985.04.16
申请人 NEC CORP 发明人 NAGASE TOSHIO;FUJIGAYA YUKIO
分类号 B23K3/06;B41F15/08;H05K3/12;H05K3/34 主分类号 B23K3/06
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