| 发明名称 |
PRINTED CIRCUIT BOARD HAVING IMPROVED ATTACHING PROPERTY SOLDER MASK AND METAL |
| 摘要 |
<p>A method for making a printed circuit board which includes a u.v. curable solder mask coating over a substrate including a metal, comprising a step which improves the adhesion between mask and metal by applying a primer film to said substrate from an aqueous solution which includes 0.01 to 10 % by weight of a carboxyl-containing polymer or copolymer. </p> |
| 申请公布号 |
JPS61234593(A) |
申请公布日期 |
1986.10.18 |
| 申请号 |
JP19860056041 |
申请日期 |
1986.03.13 |
| 申请人 |
M & T CHEM INC |
发明人 |
POORU RINGU KONGU HANGU;RICHIYAADO JIEIMUZU REIDEIGAN;DEIBUITSUDO SUKOTSUTO ROOZEN |
| 分类号 |
C09J5/00;B23K35/22;C09J5/02;H05K3/28 |
主分类号 |
C09J5/00 |
| 代理机构 |
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