| 摘要 |
PURPOSE:To remove a loss of a circuit substrate by arranging and fixing plural image sensor chips on a long support substrate and super-imposing and fixing this support substrate on a long circuit substrate. CONSTITUTION:On one main surface of an insulating substrate worked a ceramic plate into a long size, a metal glaze type conductive paste composed of silver or silver-platinum or the like is applied by a screen printing method and burnt under high temperature to produce a thick film circuit substrate 8 on which a circuit conductive layer 9 is formed. By a bonding agent for a die bonding applied on a support substrate 11, an image sensor chip 10 is fixed to the support substrate 11, the substrate 11 is superimposed on the thick film circuit substrate 8, and a bonding agent 13 previously applied to the substrate is hardened to fix both the substrates. Then, the chip 10 and the circuit conductive layer 9 are connected by a metal fine line such as gold or aluminum, and thereafter, a sealing frame 15 having an upper surface on which a glass plate excellent in light transmission is bonded is bonded by a bonding agent 16 to seal the image sensor chip hermetically.
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