| 摘要 |
<p>PURPOSE:To connect an external lead and an internal circuit electrically, and to improve reliability to corrosion by conducting a metallic small-gage wire for a bonding pad with a wiring layer for an internal circuit wiring just under an aluminum layer to which the metallic small-gage wire is connected. CONSTITUTION:A bonding pad 3 is formed onto a field insulating film 2 such as an silicon oxide film shaped onto the upper surface of an silicon substrate 1. A second aluminum layer 7 is formed onto an inter-layer insulating film 5 and the layer 7 is patterned to a required shape, the upper section of the layer 7 is coated with a passivation film 8 and an opening is bored to one part of the film 8 in approximately 100mumsquare, and the second aluminum layer 7 is exposed into the opening 9, thus constituting the bonding pad 3. An opening 6 for the inter-layer insulating film 5 is positioned at approximately the center in the opening 9 for the passivation film 8, and a first aluminum layer 4 and the second aluminum layer 7 are conducted mutually through the opening 6 for the inter-layer insulating film 5.</p> |
