| 摘要 |
PURPOSE:To uniformize the fixing strength of an photosemiconductor element package and to improve the reliability of the fixing by a method wherein the photosemiconductor element package is fixed to the holders by soldering through spreadable ring springs. CONSTITUTION:A rubber ring 7 is engaged into the outer peripheral surface of the larger diameter part 1A of a photosemiconductor element package 1 and holders 6 are inserted in such a way that the front end surface 4A of the larger diameter part 1A is made to abut on the inner surface of a base plate 16A. After that, the outer diameters of spreadable ring springs 17 are reduced in such a way as to shrink the gaps of slits 17 and the spreadable ring springs 17 are inserted in a smaller diameter part 1B. The ringed back corner part 17A of each spreadable ring spring 17 is brought into elastically contact to the tapered surface 16C of each holder 6 and front end surfaces 17B are brought into elastically contact to the stepped end surface 4B of the photosemiconductor element package 1. After that, a hollow and discal solder is placed on the rear part of each spreadable ring spring 17, the solders are fused by a high-frequency heating, solders 9 are filled in the spaces, which are formed of the outer peripheral surface of the smaller diameter part 1B and cylindrical inner surfaces 6, and the photosemiconductor element package is fixed to the holders by fusing the solders 9. |
