| 摘要 |
PURPOSE:To reduce the cost of package by using a single-layer insulating substrate and an insulating frame for packaging. CONSTITUTION:Metal wiring patterns 12 are formed on the surface of a ceramic substrate 11. In the surface area of the substrate 11 surrounded by the bonding ends of the patterns 12, a CCD sensor chip 13 is die-bonded. Internal terminals on the surface of the chip 13 are connected to the corresponding bonding ends of the patterns 12 through the intermediary of boding wires 14 respectively. On the other hand, a tubular insulating frame 15 is provided around the outside of the bonding ends and fixed by bonding on the substrate 11. Moreover, the upper open end of the frame 15 is sealed up by a glass plate 17 bonded on the top of the frame 15. According to this construction, packaging is made by using the single-layer substrate 11 and the frame 15 without using an expensive ceramic substrate formed by lamination and sintering, and thus the cost of packaging can be reduced. |
