MANUFACTURE OF SEMICONDUCTOR DEVICE

摘要

PURPOSE:To mount a semiconductor element directly on a wiring substrate by a method wherein electrodes of the semiconductor element and wirings on a wiring substrate are connected with one another by adhesion of resin formed in a gap made between the semiconductor element and the wiring substrate through the intermediary of protrusion electrodes. CONSTITUTION:A metallic film 2 is formed on a transfer substrate 1 and then an insulating film 3 with inferior adhesion to resin is formed on the metallic film 2 to make openings 5 aligned with electrodes 7 of semiconductor element 6. Then protrusion electrodes 4 are formed on the parts of openings 5 by electroplating process. The electrodes 7 of semiconductor element 6 are aligned with the protrusion electrodes 4 to pressurize 9 the substrate 1 with the semiconductor element 6; the electrodes 7 are pressure-welded into the protrusion electrodes 4; and resin 8 is filled in the gap to be cured not completely but halfway. Next the transfer substrate 1 is peeled off from the interface between the insulating film 3 and the resin 8 to transfer the protrusion electrodes 4 to the electrodes 7 side of semiconductor element 6. Finally the protrusion electrodes 4 of semiconductor element 6 may be pressure-welded into wirings 12 on a wiring substrate 11 to cease the pressurization by means of completely curing the resin 8.