发明名称 LASER TRIMMING METHOD FOR FILM RESISTOR
摘要 <p>PURPOSE:To prevent the damage of a resin group insulating film by previously forming the resin group insulating film containing a white pigment to a lower layer section in a film resistor, irradiating the film resistor with laser beams under the state and trimming the film resistor. CONSTITUTION:A resin group insulating film 2 containing a white pigment is applied and shaped onto a substrate 1 as a foundation layer. A film resistor 3 and an electrode 4 are formed onto the insulating film 2, thus preparing a resistance element. The upper section of the resistor 3 is irradiated by laser beams 5, and the resistor is trimmed by a laser. Consequently, since the insulating film 2 contains the white pigment, the insulating film 2 has optical reflectivity, and laser beams 5 are reflected by the insulating film 2. Accordingly, the damage of the insulating film 2 is prevented.</p>
申请公布号 JPS61208250(A) 申请公布日期 1986.09.16
申请号 JP19850049978 申请日期 1985.03.13
申请人 TOSHIBA CORP 发明人 SAITO MASAYUKI;OHIRA HIROSHI
分类号 H01L27/01;H01C17/22;H01C17/24;H01C17/242 主分类号 H01L27/01
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