发明名称 PARTIAL PLATING METHOD
摘要 PURPOSE:To obtain a partial plated film having superior adhesion by forming a plated main film on a plated base film and a masking film on the main film, stripping the unmasked part of the main film to expose the part of the base film under the unmasked part and carrying out partial plating. CONSTITUTION:A plated main film is formed on a plated base film formed on the surface of an article to be plated, and a masking film is formed on the main film except a part where a partial plated film is formed. The unmasked part of the main film is stripped with a stripping liq. capable of stripping the main film to expose the part of the base film under the unmasked part. A necessary partial plated film is formed on the exposed part of the base film and finally the masking film is removed.
申请公布号 JPS61201793(A) 申请公布日期 1986.09.06
申请号 JP19850040760 申请日期 1985.03.01
申请人 TSUKADA RIKEN KOGYO KK 发明人 KOBAYASHI RYOJI
分类号 C25D5/00;C25D5/02;C25D5/56 主分类号 C25D5/00
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