| 发明名称 |
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| 摘要 |
<p>PURPOSE:To make a surface protecting film thinner than that of a conventional printing head thanks to the harness of a semiconductor of a boron phosphide compound by using the semiconductor as the surface protecting film on a metal electrode.</p> |
| 申请公布号 |
JPS6139195(B2) |
申请公布日期 |
1986.09.02 |
| 申请号 |
JP19770069167 |
申请日期 |
1977.06.11 |
| 申请人 |
TDK ELECTRONICS CO LTD |
发明人 |
MATSUZAKI MIKIO;SASA SHOZO;TANAKA KAZUO |
| 分类号 |
H01C7/00;B41J2/335;H01L49/00;H01L49/02 |
主分类号 |
H01C7/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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