发明名称 |
WIRE BONDER WITH CONTROLLED ATMOSPHERE |
摘要 |
In order to bond a fine metal wire of a high tensile strength or a low cost to an electrode of a semiconductor chip and an external lead of a semiconductor device package, either an inert gas or an inert gas containing a predetermined concentration of oxygen is made to flow through a region in which the tip of the fine metal wire is melted by a spark discharge, parallel to the path of the discharge. |
申请公布号 |
GB2171042(A) |
申请公布日期 |
1986.08.20 |
申请号 |
GB19860005957 |
申请日期 |
1986.03.11 |
申请人 |
* NEC CORPORATION |
发明人 |
ATSUSHI * KAMIJO;HITOSHI * IGARASHI |
分类号 |
B23K20/00;B23K20/14;B23K35/38;H01L21/48;H01L21/603 |
主分类号 |
B23K20/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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