发明名称 |
Copper-based alloy and lead frame made of it. |
摘要 |
<p>A copper-based alloy for use in electrical and electronic davices, particularly as a material used for forming lead frames of semiconductor devices, which is less expensive than phosphor bronze while providing a mechanical strength and durability to repeated bending comparable with those of phosphor bronze, and also a relatively high conductivity. The inventive alloy is a copper-based alloy containing 1.2 to 2.5 wt% tin, 0.01 to 0.15 wt% phosphorous, 0.1 to 0.6 wt% nickel, 0.05 to 1 wt% zinc, and the remainder being copper and minute amounts of unavoidable impurities.</p> |
申请公布号 |
EP0190386(A1) |
申请公布日期 |
1986.08.13 |
申请号 |
EP19850101374 |
申请日期 |
1985.02.08 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
NAKAJIMA, TAKASHI C/O MITSUBISHI DENKI K.K.;KUBOSONO, KENJI C/O MITSUBISHI DENKI K.K. |
分类号 |
C22C9/02;H01L23/495;(IPC1-7):C22C9/02;H01L23/48 |
主分类号 |
C22C9/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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