| 摘要 |
<p>PURPOSE:To obtain a photocoupler in which a withstand voltage between the element mounting parts is increased by an easy and inexpensive method by processing a front end of a lead frame extended from the plane on which a light emitting element and a light accepting elements are mounted into a spherical form. CONSTITUTION:A transparent gel 44 covering a light accepting element 33 and a light emitting element 22 stops at the front end of a lead frame in the vicinity of the element mounting part and there is an air gap 77 between it and an epoxy resin 55. The front end 66 of the lead frame is processed into a spherical form. For example, the front end 66 of lead frame extended from the element mounting plane is made spherical so as to generate an air gap between it and the lead frame end part 88 extended from the opposite plane. Accordingly the front end of the nearest part of the lead frame becomes a non-projection form, which causes the uniformity of the electric field, and the insulation distance over the air gap becomes twice the thickness of the lead frame plate by a calculation thereby increasing the withstand voltage.</p> |
