| 摘要 |
PURPOSE:To release a wafer safely and surely by the pressure of ejected water and float it by injecting and ejecting water flow from a water injecting port of a concave area provided on a chuck mechanism body. CONSTITUTION:A concave area 2 forming a mechanism for adsorbing a wafer A to be ground is provided on a chuck mechanism body 1 of a grinding machine plurally according to the scale of the chuck mechanism body 1, and a water injecting port 3 for ejecting water flow is formed in the almost the center of the lower face. And ceramics 4 having porosity in porous condition or in vertical direction are rotatably fixed in the concave 2 by making them exposed on the surface of the concave 2 wholly or a little while holding a clearance 5 toward the bottom. Therefore, water is injected from the water injecting port 3 of the concave 2 drilled on the chuck mechanism body 1 to float the wafer A. |
