| 摘要 |
PURPOSE:To improve a thermal fatigue characteristic by incorporating specific % of Cd or In to solder consisting essentially of Pb and Sn and providing conductivity to a surface oxide film. CONSTITUTION:Cd is incorporated at 1-2% or In at 4-10% into the solder consisting essentially of Pb and Sn. Cd is otherwise incorporated at 1-2% or Sn at 2-10% into the solder material consisting essentially of Pb and In. The conductivity can be provided to the surface oxide film formed in the environment where the above-mentioned solder materials are used and therefore the formed strain energy is electronically or thermally dispersed. The electric resistance of the oxide film is decreased and the thermal fatigue characteristic is made approximately equal to the value in a vacuum by the above-mentioned method, by which the fatigue characteristic at a high temp. is improved.
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