| 摘要 |
PURPOSE:The titled composition excellent in reliability of moisture resistance and rapid curability and useful for semiconductor sealing, obtained by mixing a specified o-cresol epoxy resin with an inorganic filler, a curing agent and, optionally, wax, a colorant, etc. CONSTITUTION:An epoxy resin composition is obtained by kneading with heating an o-cresol epoxy resin having a molecular skeleton which is as linear as possible and having an epoxy equivalent of 175-185, a MW of 400-2,000, a diol content <=1,000ppm with an inorganic filler (e.g., silica), a curing agent (e.g., phenol novolak resin) and, optionally wax, colorant, coupling agent, flame retardant, etc., cooling the mixture and grinding the solid.
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