| 摘要 |
PURPOSE:To improve productivity by constituting a grinding device where a workpiece is retained by a rotary index arm and intermittently shifted to two grinding positions and a position between each one of supply and discharge positions in the grinding process of a bump electrode for a semi-conductive wafer. CONSTITUTION:By the help of a loader conveyor 11, a wafer 5 is fed under the retaining mechanism 4 of an index arm 3, and this arm 3 is lowered to absorbably retain 4 the wafer 5. Then, the arm 3 is lifted and 90 deg. turned for shifting the wafer 5 over a sand paper 13 and lowering the same. In this state, the wafer 5 is subjected to a grinding process. During this process, another wafer 5 is absorbably held by the retainer 4 of another arm 3. Then, it is made to rotate 90 deg. and lowered for a grinding process by grinding wheels 13 and 15. The arm 3 rotates 90 deg. further for discharging the wafer 5 and other grinding processes 13 and 15. This flow of work is repeated and productivity can be improved. |
