| 摘要 |
PURPOSE:To contrive the improvement of electric reliability and a long life by providing an exothermic material for heating a projected electrode at a required temperature at the required position of a semiconductor chip or a wiring substrate in a flip chip type semiconductor device. CONSTITUTION:An exothermic material 11 is provided on the back surface of a semiconductor chip 9 and electrically connected to the electrode 11A of a cap 2 for sealing at the mounting of the semiconductor chip 9 through a conductive and elastic contact 11B. The exothermic material 11 heats a projected electrode 10 at a required temperature through the semiconductor chip 9, appropriately welds the crack generated on the projected electrode 10 for repair recovering to nearly a normal state and the electric reliability of the semiconductor device is improved. The disconnection generated in the projected electrode 10 is also appropriately welded for repair to enable recovering to a nearly normal state, the semiconductor device can be reused and a long life can be contrived. |
