| 摘要 |
A coating composition which is suitable for the production of photopolymerisable coatings on contact wafers for solder masks, contains the following: a) an ethylenically unsaturated, polymerisable reaction product of an aromatic polyepoxide and an ethylenically unsaturated carboxylic acid. The product is solid or semisolid. b) An inert, inorganic filler. The filler and the reaction product (a) are present in a weight ratio of from 20 to 65 parts of filler to from 80 to 35 parts of reaction product. c) A photopolymerisation initiator for the polymerisable reaction product, and d) a volatile organic solvent for the polymerisable reaction product. The materials are applied to a substrate, for example to contact wafers. They are allowed to dry by evaporation of the organic solvent in order to give, on the substrate, a photopolymerisable coating which can be treated by actinic radiation, for example through a template pattern. The material treated in this way is insensitive to hot soldering and is accordingly suitable as a solder mask in the production of printed circuits. |
