| 摘要 |
<p>PURPOSE:To make it possible to manufacture a light shielding structure between light emitting and receiving chips simply without increasing the number of parts used, by injecting a light shielding resin in a groove, which is formed between the chips in a part molded by the light shielding resin, and forming a light shielding part. CONSTITUTION:A light emitting chip 2 is attached to the tip of one leadframe 1. Light receiving chips 3 are attached to other three. The chips 2 and 3 are molded by a molding part 4 comprising a light shielding resin so that the tips of all the leadframes are covered. A recess part 5 is formed in a back surface 4B of the molding part 4. Grooves 6 having openings are formed in the recess part 5. Each groove 6 is formed at a position between the light emitting chip 2 and each light receiving chip 3. After the molding part 4 is molded, a light shielding resin (e.g., a black resin) 7 is injected into the recess part in the back surface 4B. The resin is inputted to the groove 6 through its opening part. Then the resin is hardened. When the resin 7 is hardened, a light shielding part is formed.</p> |
