发明名称 STAMPING APPARATUS FOR SEMICONDUCTOR APPARATUS
摘要 PURPOSE:To make possible a stable stamping to be carried out by arranging the laser stamping heads which stamp the obverse and reverse of a semiconductor apparatus by a laser facing to each other. CONSTITUTION:The laser stamping heads 4 and 5 which stamp the obverse 6a and reverse 6b of a semiconductor 6 by a laser are arranged on the both sides of a conveying passage of a semiconductor apparatus 6 formed in a stamping station 2. The semiconductor apparatus is sent out from supply station 1 and transferred to the stamping station 2. A simultaneous stamping is carried out by the sealing head 4, 5 on the obverse and reverse of the semiconductor apparatus 6 transferred to the sealing station 2. thereby, a printing having a stable quality can be carried out without an ink dripping or the like.
申请公布号 JPS61143145(A) 申请公布日期 1986.06.30
申请号 JP19840265107 申请日期 1984.12.15
申请人 NEC CORP 发明人 SAKAMOTO HIDEO
分类号 B41F17/36;B41M5/26 主分类号 B41F17/36
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