Method for soldering a printed-circuit board which is fitted with SMD components on both sides, and a board which is soldered in accordance with this method

摘要

The invention relates to a method for soldering a printed-circuit board which is fitted with SMD components on both sides and is guided horizontally in a soldering machine. In order to be able to solder both sides of the board in one operation, the one side of the board is prepared and fitted in a manner known per se for immersion or wave soldering, and the other side is prepared and fitted in a manner known per se for the reflow soldering method. The components on the "top" are soldered at the same time as the soldering of the components on the "bottom", by the heat emitted by the soldering machine. In consequence, the soldering process is made economical and a separate procedure is saved.