| 摘要 |
PURPOSE:To obtain a compact solid-state image pick-up element with perfect screening around it by tapering the opening of a packaging substrate so that the circumference extends wider as a distance from the photodetecting plane of the element is longer. CONSTITUTION:The package substrate 20 is constituted with ceramic-forming frame bodies 201, 202 which are laminated. On the frame body 201, an electrode reed 21 is provided in a socket-pin shaped form. A light transmittable glass plate 22 is fixed airtightly to the frame body 202 with a black frit glass 24 or the like in advance so that said glass covers the tapered opening 23 of the substrate 20. Also, the bonding pad 26 of the solid-state image pick-up element 25 is positioned so as to fit for the electrode reed 21. And the element 25 is supported on the substrate 20 through a mold resin 28. At this time, the inside edge of the frame body 202 is tapered so that it extends wider as the distance from the photodetecting plane is longer.
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