| 摘要 |
PURPOSE:To prevent the quality deterioration making it feasible to moderate rapid temperature rise of sealing resin utilizing the heat of melting and vaporization by a method wherein a heat absorbing film formed of a material with melting point of 50-200 deg.C and thickness exceeding 1.0mum is provided on one surface of sealing resin. CONSTITUTION:A semiconductor element 1 is welded into the mounting part of lead frame 2 plated with gold or silver etc. using metallic brazing material etc. to be connected to the lead frame 2 with a metallic fine wires 3 for securing outer conduction. Later they are sealed into specific shape using mold resin 4. Next the main surface of sealed resin is stamped and after baking process, coated with a heat absorbing film 5. Finally carnauba wax, montan wax and polyethylene base wax group as the material of heat absorbing film with melting point at 80-130 deg.C are optimum in terms of such merits as easy handling, availability of high purity product with insulation resitance exceeding 10<12>OMEGAcm and especially needlessness of cleaning and removing process after mounting due to no corrosive property on lead frame etc. |
