| 摘要 |
PURPOSE:To prevent the generation of electrolytic corrosion in a metallic wiring by providing a protective layer consisting of the laminated structure of an org. film and an inorg. film on the metallic wiring. CONSTITUTION:The metallic wiring 8 to be formed on the front of a substrate 1 is obtd. by laminating successively the 1st layer metallic wiring 8a consisting of Cr, etc. having good adhesiveness to the soda glass of the substrate 1, the 2nd layer metallic wiring 8b consisting of Cu, etc. having good wettability with solder 9 and the 3rd layer metallic wiring 8c consisting of Cr, etc. having good adhesiveness to SiO2 as shown in the enlarged view of the section A-A'. An SiO2 film 12 as the inorg. film and a resin film 11 as the org. film are formed on the wiring 8 to prohibit the intrusion of moisture from defective parts into the film 12 and to prevent surely the electrolytic corrosion of the wiring 8.
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