CHIP-PACKAGING SUBSTRATE FOR MAGNETIC BUBBLE MEMORY DEVICE

摘要

PURPOSE:To increase the sealing surface of a cap seal and to improve adhesive strength so that thorough sealing is executed by designing a cap for protecting a chip into an approximate T shape. CONSTITUTION:A packaging substrate 2 which is made into the approximate E shape having a central piece 2a and side pieces 2b and is provided with a hole 4 for mounting the chip at the central piece 2a is formed by using a ceramic plate. A magnetic bubble memory chip 3 is mounted into the hole 4. The cap 1 of the approximate T shape for protecting the chip is formed by using the ceramic plate and an epoxy resin adhesive agent is stuck to the outside circumferential part on the rear thereof. The cap is then put on the substrate 2 and the adhesive agent is thermally cured to adhere the cap 1 to the substrate 2. An X coil 6 is inserted to the slits on both sides of the piece 2a of the substrate 2 and a Y coil 7 is so inserted thereto as to intersect with the coil 6.