发明名称 |
THERMOPLASTIC RESIN COMPOSITION FOR PLATING |
摘要 |
PURPOSE:To provide the titled compsn. which can be plated under wide plating conditions and less cause bleeding during molding and on which a plated film having excellent thermal cycling properties and peel strength can be formed, by incorporating a fluorine-contg. surfactant in a thermoplastic resin. CONSTITUTION:0.01-3.0pts.wt. fluorine-contg. surfactant (e.g. perfluoroalkyl carboxylate salt) and optionally intermediate material (e.g. ABS having a high rubber content) are blended with 100pts.wt. thermoplastic resin (e.g. ABS resin).
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申请公布号 |
JPS61120857(A) |
申请公布日期 |
1986.06.07 |
申请号 |
JP19840240443 |
申请日期 |
1984.11.16 |
申请人 |
TORAY IND INC |
发明人 |
IWAMOTO MASATOSHI;TAGUCHI TAKASHI;SATO HIROSHI;KISHIMOTO AKIHIKO |
分类号 |
C23C18/20;C08K5/00;C08K5/02;C08L25/12;C08L101/00;C25D5/56 |
主分类号 |
C23C18/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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