发明名称 THERMOPLASTIC RESIN COMPOSITION FOR PLATING
摘要 PURPOSE:To provide the titled compsn. which can be plated under wide plating conditions and less cause bleeding during molding and on which a plated film having excellent thermal cycling properties and peel strength can be formed, by incorporating a fluorine-contg. surfactant in a thermoplastic resin. CONSTITUTION:0.01-3.0pts.wt. fluorine-contg. surfactant (e.g. perfluoroalkyl carboxylate salt) and optionally intermediate material (e.g. ABS having a high rubber content) are blended with 100pts.wt. thermoplastic resin (e.g. ABS resin).
申请公布号 JPS61120857(A) 申请公布日期 1986.06.07
申请号 JP19840240443 申请日期 1984.11.16
申请人 TORAY IND INC 发明人 IWAMOTO MASATOSHI;TAGUCHI TAKASHI;SATO HIROSHI;KISHIMOTO AKIHIKO
分类号 C23C18/20;C08K5/00;C08K5/02;C08L25/12;C08L101/00;C25D5/56 主分类号 C23C18/20
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