| 摘要 |
PURPOSE:To raise a substrate temperature up to about 200 deg.C and give sufficient bonding strength to the substrate by previously forming a reinforcing pattern covering the leads at the rear surface of lead pattern of circuit substrate and executing the wire bonding thereto. CONSTITUTION:Bonding strength can be improved by providing previously a reinforcing pattern 8 indicated by the broken line to the rear surface position corresponding to the lead portion 6 prior to thermally-pressurized joint by ultrasonic wave. Here, the reinforcing pattern 8 can usually be formed simultaneously with ordinary pattern by the photo etching technique and if there is other pattern in the relevant position, it may be used in place of such reinforcing pattern. The bonding can be realized with high efficiency even in case the substrate is thin and soft by enhancing the substrate strength. |
