| 摘要 |
PURPOSE:To form an integrated-circuit package incorporating an impedance by shaping the impedance onto a substrate by a thick-film or a thin-film and connecting one end of the impedance to a lead wiring on bonding. CONSTITUTION:Resistors such as matching ones 6 are shaped onto an IC substrate 3 in thick-films through a printing technique, and one terminals 7 of the resistors 6 are arranged adjoined at the bonding ends of leads 4. An IC pellet is held on a bed 2, and each electrode for the pellet 1 and several electrode for the leads 4 are connected electrically by bonding wires 5 made of a metal such as aluminum. The terminals 7 for the impedances 6 and the bonding ends of the leads 4 are brought near sufficiently, and bonded while sections among the terminals 7 and the bonding ends of the leads 4 are set approximately as the positions of bonding, thus electrically connecting the terminals 7 and the leads 4 sufficiently. Unlike a bonding region for the IC pellet 1, a bonding region on the IC substrate 3 side can be made to be sufficiently wide, thus sufficiently partitioning the impedances and the leads. |
